Via Slash Gear
 
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IBM has
 developed a light-based data transfer system delivering more 
than 25Gbps per channel, opening the door to chip-dense slabs of 
processing power that could speed up server performance, the internet, 
and more. The company’s research into silicon integrated nanophotonics addresses
 concerns that interconnects between increasingly powerful computers, 
such as mainframe servers, are unable to keep up with the speeds of the 
computers themselves. Instead of copper or even optical cables, IBM 
envisages on-chip optical routing, where light blasts data between 
dense, multi-layer computing hubs.
 

 
 
 
“This future 3D-integated chip consists of several layers
 connected with each other with very dense and small pitch interlayer 
vias. The lower layer is a processor itself with many hundreds of 
individual cores. Memory layer (or layers) are bonded on top to provide 
fast access to local caches. On top of the stack is the Photonic layer 
with many thousands of individual optical devices (modulators, 
detectors, switches) as well as analogue electrical circuits 
(amplifiers, drivers, latches, etc.). The key role of a photonic layer 
is not only to provide point-to-point broad bandwidth optical link 
between different cores and/or the off-chip traffic, but also to route 
this traffic with an array of nanophotonic switches. Hence it is named 
Intra-chip optical network (ICON)” IBM
 
 
Optical interconnects are increasingly being used to link different 
server nodes, but by bringing the individual nodes into a single stack 
the delays involved in communication could be pared back even further. 
Off-chip optical communications would also be supported, to link the 
data-rich hubs together.
 
Although the photonics system would be considerably faster than 
existing links – it supports multiplexing, joining multiple 25Gbps+ 
connections into one cable thanks to light wavelength splitting – IBM 
says it would also be cheaper thanks to straightforward manufacturing 
integration:
 
 
“By adding a few processing modules into a 
high-performance 90nm CMOS fabrication line, a variety of silicon 
nanophotonics components such as wavelength division multiplexers (WDM),
 modulators, and detectors are integrated side-by-side with a CMOS 
electrical circuitry. As a result, single-chip optical communications 
transceivers can be manufactured in a conventional semiconductor 
foundry, providing significant cost reduction over traditional 
approaches” IBM
 
 
Technologies like the co-developed Thunderbolt from Intel
 and Apple have promised affordable light-based computing connections, 
but so far rely on more traditional copper-based links with optical 
versions further down the line. IBM says its system is “primed for 
commercial development” though warns it may take a few years before 
products could actually go on sale.